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Bergfeld Lasertech GmbH
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    • Multi-wavelength laser systems
    • Laser systems for perovskite PV
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    • Laser processes for wafer based crystalline silicon solar cells (c-Si)
    • Repair of micro electronics
    • Laser cutting of glass, sapphire and oder substrates via laser scribe and break
    • Laser cutting of ultra thin glass (UTG)
    • Laser induced forward transfer (LIFT) “laser printing” of whole electric thin-film devices
    • Laser processes for perovskite solar cells (PSC)
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March 23, 2026

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    Now available: laser systems for processing of large substrates up to 1,2 m x 2 m
Overview
  • Products
    • Multi-wavelength laser systems
    • Laser systems for perovskite PV
  • Applications
    • Laser processes for wafer based crystalline silicon solar cells (c-Si)
    • Repair of micro electronics
    • Laser cutting of glass, sapphire and oder substrates via laser scribe and break
    • Laser cutting of ultra thin glass (UTG)
    • Laser induced forward transfer (LIFT) “laser printing” of whole electric thin-film devices
    • Laser processes for perovskite solar cells (PSC)
  • About
  • Jobs
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0241 47582210
info@bergfeld-lasertech.com

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